適用製程 : 各式平面產品水平搬送。
適用製程 : PLP、FOPLP 半導體先進封裝面板級 產品搬送製程。
重點規格 :
雙ARM進行交換片搬送動作。
產品尺寸Max 700x700mm 。
產品荷重Max 10kg 。
走行T軸為客製化設計製作。
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Robot Model |
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Type of arm |
Dual Arm |
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Motion Range |
Telescopic Axis (Lower Arm) |
R1-axis |
1557mm |
|
Telescopic Axis (Upper Arm) |
R2-axis |
1557mm |
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|
Lift Axis |
Z-axis |
460mm |
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|
Rotation Axis |
θ-axis |
330° |
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Speed |
Telescopic Axis (Lower Arm) |
R1-axis |
1300mm/sec |
|
Telescopic Axis (Upper Arm) |
R2-axis |
1300mm/sec |
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|
Lift Axis |
Z-axis |
400mm/sec |
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|
Rotation Axis |
θ-axis |
2.62rad/sec |
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Repeatability |
Telescopic Axis (Lower Arm) |
R1-axis |
±0.1mm |
|
Telescopic Axis (Upper Arm) |
R2-axis |
±0.1mm |
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|
Lift Axis |
Z-axis |
±0.1mm |
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|
T Axis |
1500mm |
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|
Robot Weight |
200kg |
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Max Payload |
10kg |
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Maximum move Glass size |
W620×L750mm |
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Cleanliness |
ISO Class 3 |
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