USED FOR 12/8 INCH EPROM/FLASH ROM WAFER ERASE PROCESS
| PROJECT | SPECIFICATION |
| Applcicable Products | 12/8 inch wafer and thin workpiece |
| Device size (width X depth X height) | 60 X 80 X 60 cm |
| Power input | AC 110V 60HZ/SIMPLEX |
| Lamp Type/Power/Origin | Grid type low pressure mercury lampX1/550W/Taiwan |
| UV main wavelength | 254 nm |
| UVC illumination(new light) |
30mw/cm2(Japanese meter)/70mw/cm2(American meter) |
| Irradiation uniformity | 85% |
| Body leak-proof design | Have |
| Improper opening and closing of power in irradiation | Have |
| Over-temperature and power-off design in irradiation area | Have |
| Ballast over-temperature and power-off design | Have |
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