Process: PLP, FOPLP semiconductor advanced packaging panel-level precision coating processes.
Solutions: Various photoresists, PI, and other low-viscosity solutions.
Three Sizes Can Be Used Simultaneously:
Square 310*310mm
Square 300*300mm
Round 12"
Fully Automated Workflow: FOUP LD --> SPIN Cleaning --> SPIN Coating --> Straight Edge Washing --> HP Pre-baking --> CASSETTE ULD.
High-Cleanliness Production Environment: Class 100 cleanroom rating inside equipment.
Comprehensive Equipment Operating Parameter Setting Functions.
Production Quality Control: CIM System for Collecting Equipment Process Recipes.
All Equipment and Layoutes Can Be Customized.
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Items |
Key Specifications of SPIN Coating Auto Line | ||||
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Equipment |
LDULD+ROBOT |
SPIN CLEANER |
SPIN COATER | EBR MACHINE | HP BAKE |
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MODEL |
MLDULDRB-310*310 |
MSPCL-310*310 |
MSPCT-310*310 |
MGLE-310*310 |
M2HP-310*310 |
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Dimension |
3200(L)*1100(W) *1800(H) mm |
1200(L)*900(W) *1800(H) mm |
1100(L)*900(W) *1800(H) mm |
1000(L)*900(W) *1800(H) mm |
1000(L)*800(W) *1650(H) mm |
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Weight |
700kg |
600kg |
550kg |
280kg |
500kg |
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Main function |
Dual Arm Wafer ROBOT Transferring wafers between workstations Alignment mechanism |
Spin cleaning Alkaline cleaning solution usable Ultra-sonic shower cleaning Contact brushing N2 drying |
Spin coating Automatic liquid supply system Circular edge washing function |
Cleaning solution for square products: edge washing Edge straightness deviation within ±1mm |
2-layer cavity, upper and lower HP Temperature uniformity: 120±3 degrees Celsius |
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Work size |
Three sizes can be used together: square 310*310mm & 300*300mm & round 12" | ||||
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Control HMI |
PLC system program control, HMI human-machine interface operation |
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Tact time |
Depending on the individual equipment process parameters of each customer. |
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