Process: Horizontal transport of various flat products. Applicable process: PLP, FOPLP semiconductor advanced packaging panel-level product transport process.
Key specifications:
Dual ARM for exchange and transport.
Product size Max 700x700mm.
Product load Max 10kg.
T-axis is customized design and production.
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Robot Model |
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Type of arm |
Dual Arm |
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Motion Range |
Telescopic Axis (Lower Arm) |
R1-axis |
1557mm |
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Telescopic Axis (Upper Arm) |
R2-axis |
1557mm |
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Lift Axis |
Z-axis |
460mm |
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Rotation Axis |
θ-axis |
330° |
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Speed |
Telescopic Axis (Lower Arm) |
R1-axis |
1300mm/sec |
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Telescopic Axis (Upper Arm) |
R2-axis |
1300mm/sec |
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Lift Axis |
Z-axis |
400mm/sec |
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Rotation Axis |
θ-axis |
2.62rad/sec |
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Repeatability |
Telescopic Axis (Lower Arm) |
R1-axis |
±0.1mm |
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Telescopic Axis (Upper Arm) |
R2-axis |
±0.1mm |
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Lift Axis |
Z-axis |
±0.1mm |
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T Axis |
1500mm |
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Robot Weight |
200kg |
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Max Payload |
10kg |
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Maximum move Glass size |
W620×L750mm |
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Cleanliness |
ISO Class 3 |
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