Slit Coater for FOPLP

Process: FOPLP semiconductor advanced packaging panel-level precision coating processes.
Chemical solutions: for FOPLP, Plating resist(PR), Photosensitive insulating film PID (PI, PBO, Phenolic), TBDB (Temporary adhesive).
Panel: Glass, mold, and various package glass substrates.
Operating Size: 300*300 ~ 700*700mm (customizable).

Inquiry List (0)

Summary

Automation equipment to enhance capacity.
High stability.
Touch screen interface is user-friendly, and easy to operate.
According to customer-specific requirements, the machine can be designed according to product size.

Specification

Item	Specification
Model	MSC-370*470	MSC-550*650	MSC-1500*1850	MSC-2400*1200
Equipment dimension	2050(L)1300(W) 1700(H) mm	2360(L)1300(W) 1800(H) mm	3875(L)2850(W) 2125(H) mm	3357(L)3716(W) 2125(H) mm
Weight	2000kg	3000kg	8000kg	9000kg
Product size	370*470 mm	550*650 mm	1500*1850 mm	2400*1200 mm
Control system	PLC Control system
Takt time	30 ~ 100 sec/pcs (By case)
Uniformity	± 3% ~ 10% (By case)
Liquid viscosity	CPS 1~100
Coating speed	5~100 mm/sec
Coating wide	200~2400 mm (By case)