This device is a Wafer process equipment, the function of laser marking
1. TactTime: Standard ARM ROBOT, 18 SEC/PCS
*Note: Options double ARM ROBOT, Working time 13 SEC/PCS.
2. It has 4 Cassettes Work position, Reduce personnel corresponding time.
3. In addition to ionizer devices have to avoid damage to the product
4. Use made in Japan wafer placing ROBOT, more stability and high reliability
5. Precise rapid positioning using CCD imaging system. May correspond to 4 ", 5", 6 "wafers
do not have to manually adjust the CCD position.
6. It has contain laser with a blow-off dust extraction device and maintaining a clean
interior equipment.
7. With a HEPA filter, the Device Level Class 100 clean.
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Item |
Specification |
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Dimension |
1200(D)x1250(W)x1800(H)mm |
|
The size of the material |
Wafer,4”,5”,6” t=0.4~0.8mm |
|
Laser positioning system |
IPG (Fiber laser),Standard 20W |
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Labeling capability |
Vector graphics,text,two-dimensional codes,bar codes |
|
Position system |
Megapixel CCD |
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Labeling repeat location accuracy |
±0.1mm |
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Material handing mode |
Robot |
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Operation |
Monitor,Mouse,Keyboard (PC) |
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Power supply |
AC 220v,50/60Hz,Single-phase |
