Products > LCD module Line > Plasma Cleaning Machine,MEC-15.4
Plasma Cleaning Machine,MEC-15.4
MEC-15.4   Plasma Cleaning Machine,MEC-15.4
Features
Rapid and stable machenism with high quality plasma head improve higher good yield in the bonding process and product stability.
Summary
  • Automative in-line equipment, improves productivity
  • CCD image auto-position, high precision, high good yeild
  • High purity design, raise better good yeild
  • Touch panel interface, easy to operate
  • Wet clean offer 2 sides
  • Excellent performace of atmosphere plasma, fast processing speed
  • Customized size
Specification
Machine Dimension
1900(L)×1400(W)×1700(H)mm
Machine Weight
Approx. 1000 kg
Operation Method
PLC control system
Power Requirement
3ψ AC220V 50/60Hz
Air Pressure Requirement
Air 5~7 kg/c㎡
Vacuum Requirement
-75kpa above
Clean Room Class
Class 1000
Product Size
2~15.4"
Mechanism of Cleaning Surface
Cleaning method WET+WIP
Cleaning Precision
Distance to upper glass: within 0.5mm
Plasma Cleaning Module
MACTECH APS Cleaning machine
Cleaning Method
Air Plasma dry clean
APS Power Requirement
1ψ AC220V 50/60Hz
APS Cleaning Width
9± 1mm
APS Cleaning Width 
9± mm