Bonding automated processes, improve product stability. CCD auto-positioning, to shorten the operation time. Customized specifications to meet a variety of Bonding models, more flexible, the adjustment of space.
．CCD image automatic positioning function, high
precision and high yield
．High cleanliness of the entire machine design,
improve product yields
．Automated of Bonding moves to enhance production
capacity
．PC multi-parameter setting, simple operation, easy to
use
．Provide machine operation for many kinds of
mounting material.,Functional upgrading
．Machine design may change according to product
size requested by customers
|
|
Measurement of machine
|
1420(L)×1250(W)×1800(H)mm
|
Weight of machine
|
About
500 kg
|
Method of operation
|
PC System Control，Button switches to operate
|
Requirement of power
|
1ψ AC220V 50/60Hz
|
Requirement of Pressure
|
Air 5~
7 kg
/c㎡
|
Clean levels
|
Class 100
|
size
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3.5 Inch
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Method of loading and unloading
|
Artificial |
Precision
|
±
0.1mm
|
LCD Stage mechanism
|
Position precision
0.018mm
|
LCD Stage
|
XYθAxis Auto-tuning
|
LCD Stage
|
Flatness
0.05mm
|
|
Patch before LCD Automatic cleaning
|
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PLASMA
