．Patented
design, simple structure, easy maintenance
．Low
operating costs.
．No Static
Residue.
．No need
for warming up, just switch on and use.
．adabt to
operate Plasma supplier during In-line or Off- line.
．CDA, N2 or Ar gas optional.
．Low
temperature Plasma.
．compact plasma head.
．adapt to different kinds of material
surfaces.
．Increase
surface energy, enhance adhesiveness.
．Enhance
reliability for part sealants, adhesiveness and print.
．No EMI noise.
．In FPD Industry,
cleans ITO electrode surface during
ILB or OLB manufacturing procedures.
．Cleans
glass surface.
．Improves
surface energy of colored light filter lens
(CF), increase coating
adhesiveness.
．Clean and
improve quality for pre-treatment IC or LED
package seal.
．Clean and
improve quality for PCB surface.
．Other
material surface coarsening, cleaning and quality improving.
|
|
|
Requirement of power
|
220V±10%(1ψ) |
|
power
|
1kw |
|
Gases
|
CDA、N2、Ar |
|
Gas pressure
|
4~6kg/cm2 |
|
Gas flow
|
20~100slm(Adjustable
) |
|
Requirement of exhaust
|
200slm |
|
PLASMA
