．Patented
design, simple structure, easy
maintenance
．Low
operating costs.
．Adapt to
operate Plasma In-line or Off-line.
．Ar+O2 Gas
applicable.
．Low
temperature Plasma.
．No
electrode erosion.
．Adapt to different all kinds of material surfaces.
．Increase
surface energy, enhance adhesiveness.
．Enhance
reliability for part sealants, adhesiveness
and print.
．In FPD Industry,
cleans ITO electrode surface
during ILB or OLB manufacturing procedures.
．Cleans
glass surface.
．Improves
surface water energy of colored light filter
lens (CF), increase coating
adhesiveness.
．Clean and
improve quality for pre-treatment IC or
LED package seal.
．Clean and
improve quality for PCB surface.
．Other material
surface coarsening, cleaning and quality improving.
|
|
|
Requirement of power
|
220V± 10% (1ψ) |
|
Input power
|
150w,RF(13.56MHZ) |
|
Gases
|
Ar+O2 |
|
Gas pressure
|
2kg/cm2 (max) |
|
Gas flow (Ar)
|
3000sccm (max) |
|
Gas flow (O2)
|
100sccm (max) |
|
Cooling water
|
20℃，10L/min |
|
PLASMA
